- 工程能力
Process | Items | Process ability |
Base Material | Base size | 250mm/305mm/500mm |
Type of CU | RA/ED | |
Thickness of CU | 1/6oz~4oz | |
Materials | PI，PET， LCP | |
Layer | 1 Layer &2 Layer & Pure Copper | |
Thickness | MIM:0.05mm | |
Tolerance of plate thickness | ±0.03mm | |
Drilling hole | Minimum Hole Diameter | 0.1mm |
Drilling precision | ±0.05mm | |
Line | Line width and distance（buried hole）multilayer（～10layer） | Normal:55um/55um，MIn:50/50um |
Line width and distance（ No buried hole） | Normal:35um/35um，MIn:30/30um | |
Hole Ring Size | ≥0.125mm | |
Line Width Tolerance(3/3MIL) | ±20% | |
Alignment tolerances | ±0.05mm | |
Cover film | CVL Fitting Tolerance | Normal:±0.15mm，MIn:±0.1mm |
CVL Window opening distance from the line | ≥0.1mm | |
Prosess | Item | process ability |
Solder resist | Min. soldermask bridging | 0.1mm |
Minimum soldermask opening | 0.075mm | |
Window opening distance | ≥0.1mm | |
Solder Resist Thickness | 15um-25um | |
Words | width of words | ≥0.1mm |
Lamination | layers | 1-10 layers |
overflow glue | ≤0.15mm | |
Alignment accuracy | ±0.05mm | |
GLUE | Backing Type | 3M,TESA,NITTO |
Stiffening | type of materials | PI,FR-4,STEEL,PET |
LaminationTolerance | Manual Lamination:±0.3mm,Fixture Lamination:±0.2mm | |
Mold | Molding tolerances | Etching Mold:±0.1mm，steel mold:±0.05mm |
FPCR angles | ≥0.2mm | |
Flexures | Number of flexures | Normal:100,000 times.，Max:500,000 times. |
EMI | type of materials | NFC(FERRITE:TDK,NEC,TATSUTA,LAIRD) |
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